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Home arrow Microassembly
Packaging & Integration Print E-mail
  1. How can part-to-part, package-to-part, product-to-part and environment-to-product interactions be delivered to designers?
  2. What are the likely failure mechanisms and ageing effects of new fusions of materials in densely integrated products?
  3. How can power sources and electrical, photonic and fluidic connections best be integrated into structures?
  4. What are the interfaces to the outside world and users?
  5. How can this boundary layer of actuation and protection be best integrated with the 3D core of the product?
  6. How can packaging technologies be integrated with process technologies such that the back end packaging process disappears entirely?

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