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3D Processing - The Challenges |
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- How can high quality 3D microparts be produced in quantity and at low cost?
- How can complex microproducts be manufactured by a broader range of manufactures without recourse to the investment levels needed for the current semiconductor approach?
- How can finishing technologies prepare surfaces for joining, the integration of interconnects, or the selective transmission or adsorption of materials or energy?
- What are the likely costs and trade-offs of the envisaged techniques, in tooling, by batch and by volume?
- How can we process of wider range of materials necessary for tomorrow’s microcomponents?
- How can 3D processes themselves include packaging solutions to reduce final packaging complexity and cost?
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Last Updated ( Friday, 30 March 2007 )
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